This series of equipment is primarily designed for nano-level three-dimensional surface profiling, dual/multi-layer thin film thickness measurement, as well as critical dimension and offset measurements on wafer surface. It integrates with automation platforms for intelligent feature identification, process control, wafer handling and transport, and data communication. Its primary applications are in the front-end of the line and advanced packaging.

1、Achieves 0.1nm precision in three-dimensional surface profiling.

2、Integrates diverse measurement systems to monitor various process.

3、Supports automatic feature search and location, as well as customizable measurement report.

4、Multi-dimensional result evaluation visualizes process issues.

5、Supports batch importing and automatic data reporting to reduce labor costs