This series of equipment is primarily designed for nano-level measurements of single/multi-layer film and metal film thickness on wafers. Employing ellipsometry and spectral reflection technologies, it achieves rapid and high-precision measurement of thin film thickness and n-k values. Its primary application is in the front-end of integrated circuit.

1、Provides high-precision and highly-repeatable film thickness measurement for multiple design nodes，wide spectroscopic ellipsometer, laser ellipsometer, reflection-type film thickness gauge, stress and various other non-contact optical probes are available to cater to diverse measurement scenarios.

2、Automatic measurement task deployment and result reporting reduce labor costs.

3、Multi-dimensional measurement result evaluation visualizes process-related issues.

4、Offline analysis and batch importing optimize the time usage.