This series of equipment is primarily designed for measuring overlay errors in integrated circuit photolithography processes. By modeling data and providing feedback to the photolithography machine, it assists in minimizing alignment errors between different layers of photolithography patterns, ultimately enhancing alignment accuracy.

1、Sub-nanometer level accuracy and working modes for multiple design nodes ensure robustness against process variations.

2、Preventive diagnostics and automatic calibration guarantee stable equipment operation.

3、Equipped with automatic recipe optimization and centralized assessment and data management, effectively reducing labor costs.

4、Multi-dimensional result evaluation and display provide fast identification of process issues inline.